Semiconductor is very crucial element of tech industry.Every electronic gadget like phone,laptop,smart watch,television is made up of using semiconductor.The gadgets which process the request by the user and collect the information of user, will definitely use integrated circuit (IC).We generally read operational amplifier in physics that is what integrated circuit.IC is commonly known as microchip.
you may heard the name of motherboard it is a board where ICs are connected by wire.
You are wondering how integrated circuit are made ?
The process of making an integrated circuit involves several highly precise and complex steps,mainly conducted in cleanroom environments to prevent contamination.Here's an overview of the key stages in the IC manufacturing process.
1) Row material (silicon wafer production) -:
Silicon, the primary material for ICs, is purified form sand (silicon dioxide). The purified silicon is melted and formed into large, cylindrical ingots of single crystal silicon.
The silicon ingot is sliced into thin discs, known as wafers, typically around 200 mm to 300 mm in diameter. These wafer are then polished to create a very smooth surface.
2) Photolithography :-
The wafer is coated with a light-sensitive material called photoresist. This step prepares the wafer for patterning.
A mask or photomask, which contains the circuit design pattern, is placed over the wafer. The wafer is then exposed to ultraviolet (UV) light. The light passes through the transparent areas of the mask and alters the photoresist in those areas.
The exposed photoresist is developed, where the soluble parts are washed away, leaving behind a pattern that corresponds to the circuit design.
3) Etching :-
The wafer undergoes etching to remove the layers of material that are not protected by the photoresist. This process can be done chemically (wet etching) or with plasma (dry etching).
After etching, the remaining photoresist is removed, leaving the patterned wafer with the desired circuit layout etched into its surface.
4) Doping :-
Doping is the process of introducing impurities into specific areas of the silicon wafer to change its electrical properties. This is typically done using ion implantation or diffusion techniques, where ions of a dopant material (like boron or phosphorus) are embedded into the silicon to create regions of positive (p-type) or negative (n-type) conductivity.
5) Layering (Deposition)
An oxide layer, usually silicon dioxide, is grown on the surface of the wafer. This layer acts as an insulator or as a mask for subsequent processing steps.
Additional layers of materials, such as silicon dioxide, silicon nitride, or metals (like aluminum or copper for interconnects), are deposited onto the wafer using processes like chemical vapor deposition or physical vapor deposition.
6) Planarization :-
The surface of the wafer is smoothed and flattened using CMP to ensure that subsequent layers can be deposited uniformly. This step is crucial for maintaining the precision of the circuit patterns.
7) Metallization
Thin layers of metal (usually aluminum or copper) are deposited and patterned to create the interconnects that electrically connect the different components of the IC.
Modern ICs often have multiple layers of interconnects, separated by insulating layers, allowing for more complex circuit designs. Each layer is patterned using photolithography and etching.
8) Packaging :-
After all the layers and circuits are completed, the wafer is sliced (diced) into individual ICs, called dies.
Each die is mounted onto a package, and tiny wires are bonded to the die to connect it to the external pins of the package. The package protects the IC and allows it to be connected to a circuit board.
The packaged IC is then encapsulated in a protective material, often plastic or ceramic, to shield it from physical damage and environmental factors.
9) Testing :-
Each IC is tested for functionality and performance. This step ensures that only ICs that meet specifications are shipped.
Some ICs undergo burn-in testing, where they are operated at elevated temperatures and voltages to identify early failures.
10) Final Inspection and Shipping :-
The ICs are visually inspected for defects, and those that pass all tests are labeled and prepared for shipment.
he finished ICs are shipped to customers or integrated into electronic devices like computers, smartphones, and other gadgets.
This entire process involves highly advanced technology and strict quality control to ensure that the ICs perform reliably in various applications. Each step in the process is critical to the final product's functionality, and any errors can lead to defects or failures in the IC.
Demand of Semiconductor in India
India is a biggest tech market and also a biggest semiconductor user in the world.India had around 1.01 billion smartphone users.This is expected to increase to 1.14 billion by 2025.
Indian semiconductor market size was valued at USD 34.3 Billion in 2023 and is expected to grow USD 100 Billion by 2032.
The number of smartphone users in India is estimated to reach over one billion in 2024.IN Q2 2024, India's smartphone market achieved its highest ever Q2 value.
The indian laptop market is also one of the biggest market in the world.The revenue generated in the Laptops market in India amounts to US$2.4bn in 2024.
Revenue generation in the Electronic Market is projected to reach US$11.08bn in 2024.
Semiconductor Companies in India -
1. HCL Technology
2. Tata Elxsi
3. L&T
4. ASM Technology
5. Dixon Technology
6. Vedanta
7. Chiplogic
8) SCL (semiconductor laboratory)
9) Mistral Solutions
10) Moschip techonology
11) Taxes instrument india
12) Nxp india
These are the top companies of semiconductor in india. some of them are foreign companies but his branch is opened in india and working great.
Government initiatives to support semiconductor industry:-
Scheme for setting up of Semiconductor Fabs in India-: The Modified Schemes for Setting up of Semiconductor Fabs and Display Fabs in India shall extend fiscal support of 50% of project cost on pari-passu basis to applicants who are found eligible and have the technology as well as capacity to execute such highly capital and resource intensive projects. Government of India will work closely with the State Governments to establish High-Tech Clusters with requisite infrastructure in terms of land, semiconductor grade water, high quality power, logistics and research ecosystem to approve applications for setting up at least two greenfield Semiconductor Fabs and two Display Fabs in the country.
Compound Semiconductors / Silicon Photonics / Sensors (including MEMS) Fabs/ Discrete Semiconductor Fabs and Semiconductor ATMP / OSAT Units: The Modified Scheme for Setting up of Compound Semiconductors / Silicon Photonics / Sensors (including MEMS) Fabs / Discrete Semiconductor Fabs and Semiconductor ATMP / OSAT facilities in India shall extend fiscal support of 50% of capital expenditure on pari-passu basis to applicants who are found eligible and have the technology to execute such projects. At least 20 such units of Compound Semiconductors and Semiconductor Packaging are expected to be established with Government support under this scheme.
Semiconductor Design Companies: The Design Linked Incentive (DLI) Scheme shall extend product design linked incentive of up to 50% of eligible expenditure and product deployment linked incentive of 6% - 4% on net sales for five years. Support will be provided to 100 domestic companies of semiconductor design for Integrated Circuits (ICs), Chipsets, System on Chips (SoCs), Systems & IP Cores and semiconductor linked design and facilitating the growth of not less than 20 such companies which can achieve turnover of more than Rs.1500 crore in the coming five years.
Semi-conductor Laboratory (SCL): Union Cabinet has also approved that Ministry of Electronics and Information Technology will take requisite steps for modernization and commercialization of Semi-conductor Laboratory (SCL), Mohali. Ministry of electronics and information technology will explore the possibility for the Joint Venture of SCL with a commercial fab partner to modernize the brownfield fab facility.
India Semiconductor Mission: In order to drive the long-term strategies for developing a sustainable semiconductors and display ecosystem, a specialized and independent “India Semiconductor Mission (ISM)” has been set up. The India Semiconductor Mission will be led by global experts in semiconductor and display industry. It will act as the nodal agency for efficient and smooth implementation of the schemes for setting up of Semiconductor and Display Fabs.
Tata group is going to building first semiconductor fab in Dholera which is in Gujrat.Tata Electronics in partnership with Powerchip Semiconductor Manufacturing Corporation (PSMC) will build India’s first AI-enabled state-of-the-art Fab.The constructions are in underway and expected to run by 2026.This factory will manufacture 50000 unit wafer everyday.
"By 2030, Global semiconductor industry is expected to grow to US$ 1 trillion and Indian semiconductor demand is expected to cross US$110bn. India’s entry in the semiconductor manufacturing will significantly de-risk global supply chains and will make India a very important player in the global semiconductor industry" N Chandrasekaran, Chairman, Tata Sons said.
Tata’s expansion efforts are not limited to Gujarat. The company is also making significant progress on Rs 27,000 crore assembly and testing unit in Jagiroad, Assam. Work on this site commenced last month, with environmental assessments, flood risk analysis, and other preliminary studies already completed. The 600-acre Assam facility, scheduled to start high-volume production by mid-2025, will have a daily output capacity of 48 million chips. It will focus on three core technologies: wire bond, flip chip, and Integrated Systems Packaging (ISP), with plans to explore more advanced packaging solutions in the future.
'That's it for today!
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